Recherche

Electronic hardware design and product conceiving are changing rapidly as a result of successive technological breakthroughs.
Technology platforms and common techniques are used today across all application domains and Group operations from analogue, RF and microwave electronics architecture and developments to digital and power electronics. Product platforms and common architectures maximising modular approaches are today possible through the smart design of building blocks both in RF and Digital domains (MMIC ⁽¹⁾, FPGA ⁽²⁾, ASIC ⁽³⁾) and in conjunction with integration of high level software functionalities (Embedded Systems, SDR ⁽⁴⁾,...). Advanced packaging solution from ISP ⁽⁵⁾ to SoC ⁽⁶⁾ allows to achieve the required level of integration in most of the Group product domains (e.g. Avionics, Space,...).
Specific research and developments use enabling technologies like optics, acoustics, magnetism, tubes, base physics and space technologies while the hardware research and development teams also cover design and development in mechanics, material science, thermal engineering and fluid dynamics.

_{⁽¹⁾ Monolithic Microwave Integrated Circuit ⁽²⁾ Field Programmable Gate-Array
⁽³⁾ Application Specific Integrated Circuit ⁽⁴⁾ Software Defined radio
⁽⁵⁾ Integrated Substrate Packaging ⁽⁶⁾ System on Chip}